Copyright ©2007 by Borison Electronics Limited. All Rights Reserved.

 

 
BS3010 Forced Air Convection Reflow Oven
Key Features
Full hot air convection
3 zone control
PCB width up to 265mm

Glass top design
Bench-top unit
Detachable thermocouple
 
BS3010 is a slim size bench-top designed full hot air convection reflow soldering System with microprocessor control which can handle boards up to 265mm width With less than +/-2 centigrade degree temperatures gradient.

Glass top Design
Glass top viewing panel allows visual inspection of reflow process.

Bench-top unit
Bench-top unit can be converted to a standalone unit by use of the optional cabinet

Real time temperatures measuring
Detachable thermocouple for measuring substrate temperatures at real time

Microprocessor control
Three heating zones are control by microprocessor with less than +/-2 centigrade degree Temperature gradient
 
 
 Specifications - BS 3010 Forced Air Convection Reflow oven
No shadowing No colour sensitivity No belt load sensitivity
No hot spots No cold solder joints Full hot air convection
Full visual inspection Full microprocessor control Full environment friendly
Full user satisfaction    

  Process chamber

  860mm

  Soldering width

   265mm

  Clearance for assemblies

   25mm

  Transport system

  Stainless steel spring wires conveyor belt

  Conveyor speed

  10-60 cm / min

  Soldering temperatures

  180°C - 260°C

  Temperature accuracy

  ± 2°

  Number of zones

   3

  Warm-up time

   15 minutes

  System control

   Microprocessor

  Power

   208 / 240 VAC 3-phase
  Rated power max: 3650 Watts 

  Dimensions

   1540mm x 600mm x 360mm   (L x W x H)

  Net weight

  60kg

  Option

   Cabinet
 
 
 
 Copyright ©2007 by Borison Electronics Limited. All Rights Reserved.