Copyright ©2007 by Borison Electronics Limited. All Rights Reserved.

 

 
BS387V SMT Pick & Place Machine
Key Features
High Accuracy, High Flexibility for 0201, SOIC, PLCC, µBGA, CSP, as well as QFP
PCB size up to 900mm x 400mm
Vision On the Fly Alignment System
Bottom Vision Alignment System for fine pitch QFP & µBGA
Smart Feeder ID system provide fast set up and easy programming
Allow installing 152 pcs Smart Feeder (8/12mm) & 4 pcs IC Trays simultanously
Windows 2000 Software and Universal CAD Conversion
Suitable for small & medium volume production.
     
 
Enormous Work Area and Capacity for up to 224 Smart Tape Feeders
For surface mount assembly contractors who build relatively short runs of a wide variety of product, pick and place machine setup time often weighs heavily in assembly cost calculations. With its extraordinary feeder capacity and huge X-Y travel range, the Autotronik BS387 allows users to designate permanent feeder locations for a large number of their most frequently used components. The result is dramatically reduced setup time and quick changeover from one project to the next. As a stand-alone system, fully loaded with as many as 224 Smart 8 mm Tape Feeders, the BS387 maintains an enormous 39.4" x 12.0" work area, providing ample real estate that can be shared by several IC/QFP trays and even the largest PCBs. The affordability of the BS387 also allows the distribution of workload across multiple, conveyorized machines for speed, throughput, and flexibility that challenges some of the industry's most advanced, higher-volume, surface-mount assembly lines. Even in the standard, conveyorized configuration, the BS387 can hold up to 160 Smart 8 mm Tape Feeders and 4 (140 x 330 mm) IC trays and still accommodate a 16.1" (408 mm) x 12.5" (318 mm) PCB.
 
Precision for Ultra-Fine-Pitch [.012" (0.3 mm)] QFPs
The dual-head BS387 features full Cognex® vision processing and head-mounted vision cameras for non-contact, "vision-on-the-fly" alignment and 5500 cph placement of all components up to 16 mm x 14 mm; from the smallest 0201 devices through CSPs, µBGAs, flip-chips, and ultra-fine-pitch [.012" (0.3 mm) lead pitch] QFPs. A bottom vision camera is used for large components up to 38 mm x 38 mm and components with alignment features on the bottom of the device. Unlike systems that utilize laser centering methods, the power and flexibility of the Cognex® vision processor, when combined with a fine-resolution, linear-encoded X-Y drive mechanism, allow the BS387 to deliver a remarkable ± .002" (± .05 mm) placement accuracy and make it one of the few machines on the market that can truly be considered a bonafide, all-in-one, surface mount placement system for any type of component.
 
A Full Catalog of Smart Feeders and Accessories
Autotronik offers a full catalog of feeders and accessories to accommodate virtually any type of SMD component packaging, highlighted by our precision tape and stick/tube feeders which utilize our exclusive "Smart Feeder" communication and control technology. The innovative design of our feeder bases and mounting hardware allows almost limitless flexibility in feeder combinations and arrangement schemes, as almost every feeder can be ordered, loaded, programmed and mounted independently. When loading or changing feeders, operators are not forced to remove banks or cassettes of multiple feeders.
 
Optional Dispensing Capability Adds Another Dimension of Flexibility
An optional micro-dispensing head, mounted in tandem with the placement head, can be used to apply solder paste and adhesives. Fully-integrated with the MC-300 Series Pick and Place Control Software for quick setup and programming, the dispensing system allows application of precise solder paste volumes and patterns, and bypasses the need for costly and time-consuming stencil production when trying to meet your time-to-market window. We offer both our patented ATP Digital Dispensing which can apply solder paste and adhesives at dot sizes down to 0.15 mm diameter and a conventional time-pressure dispense system.
 
 
Additional information

Deep architecture maintains large PCB and Feeder capacity in all configurations Safe and easy loading and unloading of IC Trays Dual placement heads and On the Fly Alignment (for BS387V2) 39.4” x 14.2” placement area with 224 Smart Tape Feeders
Robust, linear-encoded drive for enhanced precision & accuracy Bottom Camera for Large Components up to 38 mm square Powerful Windows®-based control software
Optional Dispensing head applies 6 mil diameter dot sizes

 

 Specifications - BS387V SMT Pick & Place Machine
 
BS387V1
BS387V2

  No. of Head
   (Vision on the Fly)

  1
2

  Maximum placement rate

4000 CPH  
6400CPH
  Maximum PCB capacity   360mm x 900mm (224 feeders installed)
  360mm x 360mm
  (224 feeders with 4 waffle trays installed)
  408mm x 318mm
  (160 feeders, with conveyor, with 4 waffle trays installed)
  Tape Feeder capacity (8 / 12mm)
   - Without conveyor
   - With conveyor

  Up to 224
  Up to 160

  IC Tray capacity

  Up to 6 Waffle trays
  Component Size
   - Minimum
   - Maximum (w/ Vision-on-the-Fly)
   - Maximum (w/ Bottom vision)

  0.6mm x 0.3mm (with NZ-0201 Nozzle, optional)
  16mm x 14mm
  38mm x 38mm

  Resolution

  X/Y axis 0.005mm DC Servo Motor (Linear Encoder)
  Z axis 0.02mm DC Servo Motor
  Placement accuracy   +/- 0.05mm
  X-Y Repeatability   +/- 0.01mm

  Driving Machanism

  Closed-loop DC Servo Motor with Linear Encoder
  Rotation   0 to 360 degree (0.045 degree / step DC Servo Motor)
  Programming   Vision teach-in, Direct input, CAD Access
  Component Sense   Vision detection
  Main Control & Display   Industrial PC & LCD color monitor
  Machine Dimension   1700mm x 940mm x 1250mm (L x W x H)
  Weight   600kg
  Voltage requirement   100V or 240V, AC
  Power
1800W
2100W
  Air Pressure   75 psi (5.5 bar)

 

 Copyright ©2007 by Borison Electronics Limited. All Rights Reserved.