Borison Electronic Limited

BS391V SMT Pick & Place Machine

Key Features

	High Accuracy, High Flexibility for 0201, SOIC, PLCC, µBGA, CSP, as well as QFP
	Up to 6400 cph
	Vision On the Fly Alignment System
	Bottom Vision Alignment System for fine pitch QFP & µBGA
	Built in camera system with Auto Smart Fiducial Mark Learning
	Smart Feeder ID system provide fast set up and easy programming
	Tray handler access up to 14 waffle trays
	Windows 2000 Software and Universal CAD Conversion
	Suitable for small & medium volume production.

Place Any SMD with Vision-On-The Fly and Cognex® Vision Processing
By far the most accurate and versatile pick and place system in its price range, the Dual-Head Autotronik BS-391 provides high-precision placement of the full range of SMDs, from the smallest 0201 devices through CSPs, µBGAs, flip-chips, ultra-fine-pitch [.012" (0.3 mm) lead pitch] QFPs...even odd-form components...at placement rates of approximately 5500 cph. Designed for medium- to high-volume assemblers whose requirements push the limits of the industry's latest component technology, the BS-391 features Cognex® vision processing and head-mounted vision cameras for non-contact, "vision-on-the-fly" alignment of all components up to 16 mm x 14 mm. A bottom vision camera is used for large components up to 38 mm x 38 mm and devices with alignment features on their bottom side. Unlike systems that utilize laser centering methods, the power and flexibility of the Cognex® vision processor, when combined with a fine-resolution, linear-encoded X-Y drive mechanism, allow the BS-391 to deliver a remarkable ± .002" (± .05 mm) placement accuracy and make it one of the few machines on the market that can truly be considered a bonafide, all-in-one, surface mount placement system for any type of component.

11" x 26" PCB Area with 96 Smart Tape Feeders and Standard Conveyor
The affordability of the BS-391 also allows the distribution of workload across multiple, conveyorized machines for speed, throughput, and flexibility that challenges some of the industry's most advanced, higher-volume, surface-mount assembly systems. In the standard, conveyorized configuration, the BS-391 can hold up to 96 Smart 8 mm Tape Feeders with 1 (140 x 330 mm) IC tray and can still accommodate an 11.1" (283 mm) x 26" (660 mm) PCB. As a stand-alone unit without the conveyor and fully-loaded with 160 Smart Tape Feeders, the BS-391 still offers an extremely generous placement area of 14.75" (375 mm) x 23.4" (595 mm) that can be shared by PCBs and waffle trays. For conveyorized feeder arrangements, click here. Or, for non-conveyorized feeder arrangements.

A Full Catalog of Smart Feeders and Accessories
Autotronik offers a full catalog of feeders and accessories to accommodate virtually any type of SMD component packaging, highlighted by our precision tape and stick/tube feeders which utilize our exclusive "Smart Feeder" communication and control technology. The innovative design of our feeder bases and mounting hardware allows almost limitless flexibility in feeder combinations and arrangement schemes, as almost every feeder can be ordered, loaded, programmed and mounted independently. When loading or changing feeders, operators are not forced to remove banks or cassettes of multiple feeders.

Optional Dispensing Capability Adds Another Dimension of Flexibility
An optional micro-dispensing head, mounted in tandem with the placement head, can be used to apply solder paste and adhesives. Fully-integrated with the BS-300 Series Pick and Place Control Software for quick setup and programming, the dispensing system allows application of precise solder paste volumes and patterns, and bypasses the need for costly and time-consuming stencil production when trying to meet your time-to-market window. We offer both our patented ATP Digital Dispensing which can apply solder paste and adhesives at dot sizes down to 0.15 mm diameter and a conventional time-pressure dispense system.

Additional information

Robust, linear-encoded drive for enhanced precision & accuracy	Dual placement heads and On the Fly Alignment (for BS391V2)	14.7” x 16.7” placement area with 160 Smart Tape Feeders	BS391V versatility suits variable component mixes

Bottom Camera for Large Components up to 38 mm square

Optional Dispensing head applies 6 mil diameter dot sizes

Powerful Windows®-based control software

Automatic datum point recognition of PCBs, which is particularly useful when combined with the inline conveyor system

Specifications - BS391V SMT Pick & Place Machine
	BS391V1	BS391V2
No. of Head (Vision on the Fly)	1	2
Maximum placement rate	4000 CPH	6400CPH
Maximum PCB capacity without conveyor	Up to 660mm x 365mm without Waffle Tray Up to 660mm x 335mm with 1 Waffle Tray
Maximum PCB capacity with conveyor	Min: 50mm x 55mm Max (without Waffle Tray): 660mm x 330mm Max (with 1 Waffle Tray): 660mm x 283mm Max (with 2 Waffle Trays): 660mm x 180mm Max (with 3 Waffle Trays): 660mm x 155mm
Tape Feeder capacity (8mm) - Without conveyor - With conveyor	Up to 160 Up to 96
IC Tray capacity	Up to 4 Waffle trays Up to 14 Waffle tray with TH-14 Tray Handle (option)
Component Size - Minimum - Maximum (w/ Vision-on-the-Fly) - Maximum (w/ Bottom vision)	0.6mm x 0.3mm 16mm x 14mm 38mm x 38mm (with BV38, option) 50mm x 50mm (with BV50, option)
Resolution	X/Y axis 0.005mm DC Servo Motor (Linear Encoder) Z axis 0.02mm DC Servo Motor
Placement accuracy	+/- 0.03mm
X-Y Repeatability	+/- 0.01mm
Driving Mechanism	DC-Servo Motor (X, Y, Z, and R Axes) with Closed-Loop Encoding; Linear Encoding (X-Y Axes)
Rotation	0 to 360 degree (0.045 degree / step DC Servo Motor)
Programming	Vision teach-in, Direct input, CAD Access
Component Sense	Vision checking
Main Control & Display	Industrial PC & LCD color monitor
Machine Dimension	1080mm x 1050mm x 1350mm (L x W x H)
Weight	550kg
Voltage requirement	100V or 240V, AC
Power	1800W	2100W
Air Pressure	75 psi (5.5 bar)