BA385V SMT Pick & Place Machine
    • High Accuracy, High Flexibility for 0201, SOIC, PLCC, µBGA, CSP, as well as QFP, up to fine-pitch 0.3mm
    • Up to 8 000 cph.
    • Vision On the Fly Alignment System.
    • Bottom Vision Alignment System for fine pitch QFP & µBGA.
    • Built in camera system with Auto Smart Fiducial Mark Learning.
    • Smart Feeder ID system provide fast set up and easy programming.
    • Windows XP Software and Universal CAD Conversion.
    • Suitable for small volume production.


Most Affordable, Most Precise, Full-Vision Placement System

The Autotronik BS-384 provides the versatility, precision, and increased capacity needed for today's most challenging front-end surface mount prototyping, product development, and pilot-production applications. Cognex® vision processing and head-mounted vision cameras allow non-contact, "on-the-fly" alignment of a wide range of standard and odd-form SMDs, from the smallest 0201 devices through CSPs, μBGAs, flip-chips and other components up to 16 mm x 14 mm, including 0.5 mm (20 mil) fine-pitch QFPs. A bottom vision station is used for larger components up to 38 mm x 38 mm. Even fully-loaded with a whopping expanded capacity for up to 128 Smart Tape Feeders, the BS-384 can still handle PCBs up to 14.5" x 13.4".

Capacity for Up to Four 32-Port Smart Feeder Bases

Autotronik Smart Feeder Bases can be mounted on all four sides of the BS-384 and each can be loaded with up to 32 Smart 8 mm Tape Feeders. In this arrangement, 14.5" x 13.4" (370 mm x 340 mm) of payload area can be shared by PCBs and waffle trays. Placement area increases to a generous 17.1" x 13.4" (435 mm x 340 mm) with feeder bases mounted on only the front and rear of the system. Click here for feeder arrangements.

Full Catalog of Smart Feeders and Accessories

To go along with the BS-384's large payload capacity, Autotronik offers a full catalog of feeders and accessories to accommodate virtually any type of SMD component packaging, highlighted by our precision tape and stick/tube feeders which utilize our exclusive "Smart Feeder" communication and control technology. The innovative design of our feeder bases and mounting hardware allows almost limitless flexibility in feeder combinations and arrangement schemes, as almost every feeder can be ordered, loaded, programmed and mounted independently. When loading or changing feeders, operators are not forced to remove banks or cassettes of multiple feeders. For additional information on our feeder portfolio, visit our Autotronik Smart Tape Feeder and Smart Stick Feeder Pages.

Optional Dispensing Capability Adds Another Dimension of Flexibility

An additional micro-dispensing head, mounted in tandem with the placement head, can be used to apply solder paste and adhesives. Fully-integrated with the BS-300 Series Pick and Place Control Software, the dispensing system allows application of precise solder paste volumes and patterns, and bypasses the need for costly and time-consuming stencil production when trying to meet your time-to-market window. We offer both our patented ATP Digital Dispensing which can apply solder paste and adhesives at dot sizes down to 0.15 mm diameter and a conventional time-pressure dispense system.


Number of Heads(Vision on the Fly): BA385V1:

Placement rate:

4000 CP/H (under the optimum condition)
3400 CP/H (IPC 9850)

8000 CP/H (under the optimum condition)
5500 CP/H (IPC 9850)
Feeder capacity (8 mm) without conveyor: up to 128 Tape Feeders
Feeder capacity (8 mm) with conveyor: up to 64 Tape Feeders
IC Tray capacity:
BA385V1, BA385V2:
up to 2 Waffle Trays
Component Sense: Vision detection
Component Size
Handled by head camera:
- Smallest: 0.6 x 0.3mm - Largest: 16 x 14 mm
Handled by fixed Bottom Vision Camera:
- Smallest: 0.4 x 0.2 mm (option) - Largest: 150 x 100 mm (option)
Resolution: X / Y axis 0.005 mm Servo Motor
Z axis 0.02 mm Servo Motor
Rotation: 0 to 360° (0,09°/step) Servo Motor
Placement Accuracy: +/- 0.04 mm
+/- 0.03 mm (by optional linear encoder)
X-Y Repeatability: +/- 0.01 mm
Placement Area:
Placement area without conveyor:

Max. 435 x 430 mm without Waffle Trays
Max. 435 x 270 mm with 1 Waffle Tray
Max. 435 x 130 mm with 2 Waffle Trays
Placement area with conveyor:

Max. 435 x 460 mm without Waffle Trays
Max. 435 x 310 mm with 1 Waffle Tray
Programming:: Direct input, Vision teach-in, CAD Access (Option)
Main Control: Industrial PC
Operation system: Windows 7
Weight: 690 kg
Power: 220 V / AC

Pressure: 75 psi (5.5 bar), 200 L/min
Machine Size: 1400 x 990 x 1700 mm (W x D x H)

* We reserve the right to make changes without notice.

Features & Optional Accessories

Exceptional Placement Area and Feeder Capacity Head-Mounted Vision Camera for “On-the-Fly” Alignment Bottom Vision Camera for Fine-Pitch QFPs, μBGAs, CSPs (with BV38, option)

Optional Dispense Head Applies 6 mil Dot High-Precision Ball-Screw X-Y Drive Mechanism Powerful Windows®-based control software

Automatic datum point recognition of PCBs, which is particularly useful when combined with the inline conveyor system    

Video demo

Production features for BA385V

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Pick & Place Machine